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Record-Breaking 21st Edition of Automechanika Dubai Opens Today With a 15% Increase in Exhibiting Companies

Record-Breaking 21st Edition of Automechanika Dubai Opens Today With a 15% Increase in Exhibiting Companies Automechanika Dubai 2024 was officially opened by H.E. Mattar Al Tayer, Commissioner General for Infrastructure, Urban Planning and Well-Being Pillar and Director General, Chairman of the Board of Executive Directors...

ENVALIOR HONORED AS HITACHI ASTEMO’S LEADING GLOBAL MECHANICAL SUPPLIER

ENVALIOR HONORED AS HITACHI ASTEMO’S LEADING GLOBAL MECHANICAL SUPPLIER Envalior wins Hitachi Astemo's Global Supplier of the Year award for outstanding quality and service. Envalior supplied key raw materials to Hitachi Astemo North America, including Akulon PA6 in 2023. This award showcases Envalior’s dedication...

SPE NAMES DONALD (DON) HYLTON THERMOFORMER OF THE YEAR

SPE NAMES DONALD (DON) HYLTON THERMOFORMER OF THE YEAR The Society of Plastics Engineers (SPE) Thermoforming Division has named Donald (Don) Hylton Thermoformer of the Year. The award will be presented during SPE’s Thermoforming Awards Dinner, held in conjunction with the 30 th  SPE Thermoforming Conference. ...

XSYS Launches Nyloflex XSN For Superior Performance And Flexibility In narrow Web Printing

XSYS Launches Nyloflex XSN For Superior Performance And Flexibility In narrow Web Printing Ideal for narrow web applications using UV, water-based, and solvent-based inks Inherent flat-top dot plate compatible with both thermal and solvent processing Enhanced formulation with CleanRelease Technology for reduced downtime and...

Swop 2024 Concludes With Success, Paving The Way For Future Innovation In The Packaging Industry

Swop 2024 Concludes With Success, Paving The Way For Future Innovation In The Packaging Industry Shanghai World of Packaging (swop) came to a successful close on November 20, 2024 in Shanghai, China, marking a remarkable conclusion to the annual grand show for the packaging industry...

USIBC Signs MOU with Government of Telangana, Hosts AI and GCC Industry Roundtable

USIBC Signs MOU with Government of Telangana, Hosts AI and GCC Industry Roundtable The U.S. Chamber of Commerce’ s U.S. India Business Council Global Private Limited (USIBC GPL) and the Department of Information Technology, Electronics & Communications (IT E&C), Government of Telangana, signed a Memorandum...